AI boom accelerates revenue growth at world's largest chipmaker TSMC

microchip / TSD Studio
Фото: microchip / TSD Studio

The revenue of the world's largest contract semiconductor manufacturer TSMC increased by 53.3% in August compared to the same month last year. The company continues to benefit from massive investments by technology corporations in artificial intelligence, while demand for the most advanced chips exceeds available production capacity. Bloomberg reports this.

New data indicate a further acceleration of the Taiwanese manufacturer's business amid the construction of data centers and the build-up of computing infrastructure for AI worldwide.

TSMC is a key manufacturing partner of major technology companies, including Nvidia, Apple, AMD and Broadcom. Particularly high remains the demand for advanced technology processes and capacities for packaging high-performance processors used in artificial intelligence systems.

Growth in August accelerated compared to July. At that time TSMC's revenue was 467.58 billion new Taiwan dollars and increased by 44.7% year-on-year. This was the company's record monthly result at that moment.

For January-July, TSMC received 2.87 trillion new Taiwan dollars in revenue, which is 37% more than in the same period of 2025.

The company earlier raised its forecast for the whole of 2026. Now TSMC expects revenue growth of more than 40% in dollar terms, explaining the revision primarily by sustained demand for computing power for AI.

The boom is forcing the manufacturer to simultaneously increase investment. TSMC has raised its capital expenditure plan for 2026 to $60-64 billion. A significant part of the funds is directed towards expanding the most advanced production processes and advanced chip packaging.

At the end of the second quarter, TSMC's revenue was 1.27 trillion new Taiwan dollars, and net profit was 706.56 billion. The company continues to increase production, but demand from global developers of AI systems remains higher than the available supply of advanced capacity.

Based on materials from: Bloomberg, TSMC

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