ASML Unites TSMC, Samsung and Intel Around New AI Chip Technology
Dutch ASML has gained the support of leading semiconductor manufacturers TSMC, Samsung Electronics and Intel to transition to a new photomask format that should improve production efficiency of the most complex artificial intelligence chips. The industry plans to move from traditional 6-inch to 12-inch photomasks for the next generation of High NA EUV lithography systems.
ASML and the world's largest contract chip manufacturer TSMC announced the creation of a joint industry initiative, joined by other key players in the semiconductor market. Bloomberg names Samsung and Intel among the companies supporting the transition.
A photomask, or photomask, contains the circuit of the future chip, which a lithography machine transfers onto a silicon wafer. The semiconductor industry has used the standard 6-inch format for decades, but it creates limitations for new High NA EUV systems capable of printing significantly smaller features.
The transition to larger photomasks should allow manufacturers to more fully utilize High NA EUV capabilities, increase equipment productivity, lower the cost of leading-edge chips, and overcome some technological limitations in manufacturing large processors.
Pilot line planned to launch by 2031
ASML and TSMC plan to create a pilot production line for 12-inch photomasks by 2031. Full readiness of the corresponding lithography systems for advanced chip production is expected by 2033.
Until then, High NA EUV systems will continue to work with current photomasks. Thus, the transition to the larger format will happen gradually, without delaying the adoption of the newest generation of lithography.
TSMC said it plans to start using High NA EUV in mass production of advanced process nodes from 2030. The company expects that with increasing complexity of transistors for AI accelerators, the number of layers requiring High NA EUV will grow.
Samsung plans to use High NA EUV for memory
Samsung Electronics separately confirmed joining the initiative for the development of 12-inch photomasks. The South Korean company plans to be the first in the industry to introduce High NA EUV into mass production of DRAM memory by 2028.
For Samsung, the technology is important for two key areas – memory production and contract manufacturing of logic processors. The company expects larger photomasks will help reduce costs for future generations of high-performance semiconductors.
Intel, in turn, has outpaced competitors in the practical use of High NA EUV. In July, ASML reported that Intel Foundry already applies such systems to certain layers of Core Ultra processors based on Intel 18A technology. This was the first case of using High NA EUV in a mass production environment.
AI forces manufacturers to rethink technologies
One of the main reasons for the transition is the rapid increase in complexity of chips for data centers and artificial intelligence systems. Companies such as Nvidia, Google, and other accelerator developers create increasingly larger processors, approaching the physical limits of current lithography technologies.
High NA EUV is the next generation of extreme ultraviolet lithography technology from ASML. It enables printing smaller features and packing more transistors on a single chip, which is especially important for powerful AI accelerators and server processors.
ASML is essentially the only supplier of the most advanced EUV equipment for the global semiconductor industry. Support for the new technological standard from TSMC, Samsung and Intel significantly increases its chances of widespread adoption in the production of next-generation chips.
Source: Bloomberg, ASML and TSMC, Samsung Electronics
